SDLCSA Supermicro Direct Liquid Cooling Service Associate (SDLCSA) Exam Free Practice Exam Questions (2025 Updated)

The training focuses on Supermicro’sDirect to Chip (DLC)liquid cooling, as indicated by the context of SYS-421GE-TNHR2-LCC and Supermicro’s expertise in DLC solutions (e.g., cold plates, CDUs up to 100kW). DLC circulates coolant directly to CPUs/GPUs, reducing OPEX by 40% and supporting high-density racks. A (RDHx) cools via rear doors, B (Evaporative) uses evaporation, and C (ILC) submerges servers—none match Supermicro’s DLC emphasis here. D is the verified type.References:Supermicro DLC whitepapers, SYS-421GE-TNHR2-LCC cooling specs.

In Supermicro’s high-end servers like the SYS-421GE-TNHR2-LCC, PSUs are typically located at the back of the chassis for accessibility and cooling efficiency, a design consistent with DLC rack-scale solutions (e.g., SYS-420GP-TNAR). The mention of a “dummy PSU tray” suggests a placeholder or empty slot, common in modular designs to maintain airflow or allow future expansion. This layout is standard in Supermicro’s DLC systems, where PSUs power both compute and cooling components (e.g., pumps, CDUs). No contradicting evidence exists, and True (A) aligns with Supermicro’s chassis architecture, making it the correct answer.

References: Supermicro chassis design specs, DLC system PSU placement.

In Supermicro systems like the SYS-421GE-TNHR2-LCC, internal fans and their housing are typically located in themiddle of the motherboard tray, providing airflow across CPUs and memory, even in DLC setups where liquid cooling handles primary heat removal. This placement, seen in similar systems (e.g., SYS-420GP-TNAR), balances cooling distribution. A and B (PCIe tray) focus on GPU cooling, not motherboard fans, while C (back of motherboard tray) is less common due to PSU placement. Supermicro’s DLC hybrid designs integrate fans centrally on the motherboard tray, making D correct.References:Supermicro chassis layouts, DLC hybrid cooling configurations.

When inserting a DIMM in Supermicro systems, proper seating is confirmed by aclickas the slot latches snap into place, securing the module (e.g., SYS-420GP-TNAR manuals). This audible feedback is standard in DLC systems for reliable memory installation. B (green button) isn’t a feature, C contradicts correct insertion, and D (wiggling) indicates failure. Supermicro’s design ensures firm DIMM placement, making A the verified sign.References:Supermicro DIMM installation guides, DLC system component reliability.

In Supermicro systems, the BMC (Baseboard Management Controller) card is secured with asingle, shorter screwto its bracket, while the BMC cable uses2 longer screwsfor robust attachment to the PCIe tray, per standard designs (e.g., SYS-420GP-TNAR). This difference accommodates component size and mounting depth in DLC setups. True (A) reflects Supermicro’s hardware specificity, making it the correct answer over B.References:Supermicro BMC installation guides, DLC system component specs.

In Supermicro systems like the SYS-421GE-TNHR2-LCC, M.2 drives are typically mounted on the motherboard for fast storage in high-performance computing (HPC) and AI workloads, often cooled indirectly by DLC systems. To access the M.2 drive, you must:

Remove the motherboard tray from the chassis: This exposes the motherboard where M.2 slots reside.

Remove the air shroud from the motherboard tray: The shroud covers components for airflow or hybrid cooling, and its removal provides access to the M.2 slot.

Option D aligns with Supermicro’s design, as seen in manuals (e.g., SYS-420GP-TNAR), where M.2 drives are motherboard-mounted. A is incorrect since M.2 drives are serviceable; B (GPU tray) and C (fan housing) don’t house M.2 drives in this context. Supermicro’s DLC solutions prioritize motherboard accessibility, making D the correct procedure.

References: Supermicro motherboard tray manuals, DLC system component layouts.

Replacing an NVMe SSD in a Supermicro system like the SYS-421GE-TNHR2-LCC, which supports Direct Liquid Cooling, follows a standard procedure for hot-swappable drives in high-performance servers. The correct sequence, as outlined in Supermicro’s general server maintenance guides (e.g., for SYS-420 series or similar DLC-enabled systems), is:

Remove failed drive/drive carrier from chassis carriage: NVMe drives are housed in carriers for easy access and hot-swap capability, a feature emphasized in Supermicro’s DLC rack-scale solutions for minimizing downtime in AI/HPC workloads.

Remove failed drive from drive carrier: The carrier is opened to extract the faulty NVMe SSD.

Insert new drive into drive carrier: The replacement NVMe SSD is secured into the carrier.

Insert new drive/drive carrier into chassis carriage: The carrier is reinserted into the chassis, ensuring proper connection.Option D accurately reflects this logical order. Option A incorrectly involves DIMMs (memory modules), B mentions a fan (unrelated to NVMe replacement), and C involves a CPU (not part of the process). Supermicro’s DLC systems prioritize modularity and serviceability, making D the verified procedure.References:Supermicro NVMe SSD replacement guides (e.g., SYS-420GP-TNAR Manual), DLC solution serviceability features.

In Supermicro systems with 2 M.2 slots (e.g., SYS-421GE-TNHR2-LCC), the slots are typically interchangeable unless specified by BIOS or hardware configuration (rare in standard setups). Re-installing an M.2 drive to the same slot isn’t critical for functionality, as the system auto-detects it, per Supermicro manuals. False (B) aligns with DLC system flexibility, making it correct over A.References:Supermicro M.2 installation guides, DLC system storage configs.

The AOM module (AOM-GP401-PCIE) in Supermicro systems is a PCIe-based add-on module, typically for expansion cards like NICs (Network Interface Cards). The AOC NIC card (Add-On Card, Network Interface Card) is the most likely connection, as Supermicro’s AOM modules (e.g., in SYS-420 series) are designed to interface with AOC cards for networking in DLC systems. A (AOM card) is vague and not a standard term, while B and D (credit/debit cards) are irrelevant. Supermicro’s DLC solutions integrate high-speed networking, making C the verified choice.

References: Supermicro AOM module specs, DLC system networking components.

The BMC (Baseboard Management Controller) cable and IO Module in Supermicro systems like the SYS-421GE-TNHR2-LCC are often tied to add-on cards (AOC) within the PCIe tray. The AOC cage (likely an Add-On Card cage) must be removed first to access these components, as it houses cards and cables interfacing with the BMC. Supermicro’s design (e.g., SYS-420 series) places AOC cages as sub-assemblies within the PCIe tray, requiring removal before deeper access. A (AOM cage) may be a typo or misidentification, B (BMC cage) isn’t standard terminology here, and C (PCIe tray) is too broad since it’s the parent assembly. D fits Supermicro’s DLC service hierarchy, making it correct.

References: Supermicro PCIe tray sub-assembly guides, DLC system component access.

The side bracket in the SYS-421GE-TNHR2-LCC likely houses networking or management add-ons. TheAOM-PCIe card(e.g., AOM-GP401-PCIE module) andAOC NIC card(networkinterface card) are common components in Supermicro’s DLC systems, enhancing connectivity (e.g., high-speed NICs for AI workloads). A (GPU/PCIe) mixes unrelated categories, C pairs an AOM with a GPU (less likely), and D (AOC/PCIe) lacks specificity. B aligns with Supermicro’s DLC networking focus, making it correct.References:Supermicro add-on card specs, DLC system networking components.